Soft soldering alloys are preferred to silver alloys when the working temperature cannot exceed 350°C. These alloys are therefore chosen mainly on the basis of their melting properties. TINSALD alloys are widely used in electronics (assembly or circuits) and for other structural applications, such as the assembly of non-potable water pipes, industrial fluids, compressed gases and vacuum assembly.
TINSALD 35 and TINSALD 50 are widely used in heating and plumbing and in the food industry. All these soft alloys must be used with a special flux (Flux T27 and Flux T75) that removes the surface oxidation layers created during the early stages of the soldering process, allowing the molten alloy to react to the substrate and expand evenly.
|TINSALD - TINALLOY|
|Name||ISO 3677||ISO9453||Temp. Fusion °C|
|TINSALD 100||-||-||-||99,9||-||-||-||S-Sn100||c.a. 232°C|
|TINALLOY 35||3,5||-||-||96,5||-||-||-||703||S-Sn96,5Ag3,5||c.a. 221°C|
|TINALLOY 50||5||-||95||-||-||-||-||704||S-Sn95Ag5||c.a. 221 - 240°C|
|TINSALD 9307||-||3||-||93||-||-||-||S-Sn93Cu7||c.a. 227 - 310°C|
|TINSALD 9703||-||3||-||97||-||-||-||Sn97Cu3||c.a. 227 - 310°C|